Agile Technologies, Inc.

Design

System Design

Manufacturing

Chip on Board (COB)

Chip Scale Packages (CSP)

Multi Chip Module (MCM)

Wirebonding

Flip Chip

µBGA

SMT

Test

Optical Inspection (AOI)

In Circuit Test (ICT)

X-Ray

Rework

Flip Chip

 

Material Management

Just in Time (JIT)

Dock to Stock

Kanban

Store

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Last modified: 03/11/11